Recently, Zi-Long Guo, a PhD candidate in Public Health at the Macau University of Science and Technology (MUST), published a review paper as the first author in the top-tier journal Comprehensive Reviews in Food Science and Food Safety (Impact Factor: 14.8; ranked 3rd out of 144 journals in the FOOD SCIENCE & TECHNOLOGY category by Clarivate Analytics). The paper is titled "Using bioactive compounds to mitigate the formation of typical chemical contaminants generated during the thermal processing of different food matrices."
Zi-Long Guo, PhD Candidate in Public Health, Faculty of Medicine
The corresponding author of the paper is Assistant Professor Xi Yu. This research was supported by the Macau Science and Technology Development Fund (0024/2022/A).
As consumer awareness of health continues to grow, the demand for food safety has increased significantly. Various chemical contaminants, such as polycyclic aromatic hydrocarbons (PAHs), heterocyclic amines (HCAs), and acrylamide, can be generated during the thermal processing of food. Unlike external chemical contaminants (e.g., pesticides and fertilizers), these contaminants are formed during cooking and cannot be removed before consumption. Thus, inhibiting the formation of these heat-induced chemical contaminants during cooking has become a key research focus.
Formation and Inhibition of Chemical Contaminants in Food
This paper aims to summarize the latest applications of bioactive compounds in controlling chemical contaminants during thermal food processing. It explores the mechanisms behind the formation of these contaminants and their toxic effects, shedding light on how and why certain bioactive compounds can inhibit their production. The review covers specific bioactive compounds, such as phenolic compounds and organic acids, and their practical applications. Finally, it provides insights into future developments in this area, offering new pathways to address food safety challenges.
Mechanisms of Bioactive Compounds in Inhibiting Harmful Substances Generated During Thermal Processing
